CAN总线隔离收发模块
目前，我司产品的UL档案异常，2025-08-08后的UL认证处于失效状态。我司正在积极沟通处理，不便之处敬请谅解。
TTL/CMOS电平和CAN差分信号相互转换的隔离收发模块。
——可实现信号隔离、信号转换、延长通信距离、增加通信节点、CAN总线防护等功能。
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CAN总线隔离收发模块 筛选型号个数：共 46 个，请查看下方表格。
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系列标题
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集成电源
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通道数
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传输速率(bps)
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输入电压(VDC)
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节点数
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隔离电压
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封装形式
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特性说明
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资料下载 (3D/PCB封装库/原理图库)
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认证/标准
技术
手册样品
申请
| TDA51SCANHC | √ | 1 | 1M | 5 | 110 | 5000VDC | SOIC | 高隔离 | - | - | - | - |
| TDA51SCANHC | √ | 1 | 1M | 5 | 110 | 5000VDC | SOIC | 高隔离 | - | |||
| TD041SCANFD | - | 1 | 5M | 3.3-5 | 110 | 3750VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | - | - | - |
| TD041SCANFD | - | 1 | 5M | 3.3,5 | 110 | 3750VAC | DFN | 超小，超薄，芯片级 DFN 封装 | - | |||
| TD041SCANH | - | 1 | 1M | 5 | 110 | 3750VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | - | - | - |
| TD041SCANH | - | 1 | 1M | 3.3,5 | 110 | 3750VAC | DFN | 超小，超薄，芯片级 DFN 封装 | - | |||
| CTD5(3)31SCANH | √ | 1 | 40k~1M | 3.3-5 | 110 | 2500VDC | SMD | ESD总线保护 | - | - | - | - |
| CTD331SCANH | √ | 1 | 40k~1M | 3.3 | 110 | 2500VDC | SMD | ESD总线保护 | ||||
| CTD531SCANH | √ | 1 | 40k~1M | 5 | 110 | 2500VDC | SMD | ESD总线保护 | ||||
| TD051SCANH3 | - | 1 | 5M | 3.3-5 | 110 | 5000VAC | SOIC | - | - | - | - | - |
| TD051SCANH3 | - | 1 | 5M | 3.3-5 | 110 | 5000VAC | SOIC | - | - | |||
| TD341SCAN | √ | 1 | 1M | 3.3-5 | 110 | 5000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | - | - | - |
| TD341SCAN | √ | 1 | 1M | 3.3,5 | 110 | 5000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | |||
| TD341SCANH | √ | 1 | 1M | 3.3-5 | 110 | 5000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | - | - | - |
| TD341SCANH | √ | 1 | 1M | 3.3,5 | 110 | 5000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | |||
| TD5(3)01DCANH-W | √ | 1 | 40k~1M | 3.3-5 | 110 | 3000VDC | DIP | 可唤醒高速 CAN | - | - | - | - |
| TD301DCANH-W | √ | 1 | 40k~1M | 3.3 | 110 | 3000VDC | DIP | 可唤醒高速 CAN | ||||
| TD501DCANH-W | √ | 1 | 40k~1M | 5 | 110 | 3000VDC | DIP | 可唤醒高速 CAN | ||||
| TD5(3)01DCANHE | √ | 1 | 20k~1M | 3.3-5 | 110 | 2500VDC | DIP | 高浪涌防护 | - | - | - | - |
| TD301DCANHE | √ | 1 | 20k~1M | 3.3 | 110 | 2500VDC | DIP | 高浪涌防护 | ||||
| TD501DCANHE | √ | 1 | 20k~1M | 5 | 110 | 2500VDC | DIP | 高浪涌防护 | ||||
| TD5(3)01MCANFD | √ | 1 | 5M | 3.3-5 | 110 | 2500VDC | DIP | 超小体积CANFD | - | - | - | - |
| TD301MCANFD | √ | 1 | 5M | 3.3 | 110 | 2500VDC | DIP | 超小体积CANFD | ||||
| TD501MCANFD | √ | 1 | 5M | 5 | 110 | 2500VDC | DIP | 超小体积CANFD | ||||
| TD5(3)21DCAN | √ | 1 | 5k~1M | 3.3-5 | 110 | 3000VDC | DIP | 开板式CAN | - | - | - | - |
| TD321DCAN | √ | 1 | 5K~1M | 3.3 | 110 | 3000VDC | DIP | 开板式CAN | - | |||
| TD521DCAN | √ | 1 | 5K~1M | 5 | 110 | 3000VDC | DIP | 开板式CAN | ||||
| TD5(3)21DCANH | √ | 1 | 40k~1M | 3.3-5 | 110 | 3000VDC | DIP | 开板式高速CAN | - | - | - | - |
| TD321DCANH | √ | 1 | 40K~1M | 3.3 | 110 | 3000VDC | DIP | 开板式高速CAN | ||||
| TD521DCANH | √ | 1 | 40K~1M | 5 | 110 | 3000VDC | DIP | 开板式高速CAN | ||||
| TD5(3)21SCAN | √ | 1 | 5k~1M | 3.3-5 | 110 | 3000VDC | SMD | 开板贴片式CAN | - | - | - | - |
| TD321SCAN | √ | 1 | 5k~1M | 3.3 | 110 | 2500VDC | SMD | 开板贴片式CAN | ||||
| TD521SCAN | √ | 1 | 5k~1M | 5 | 110 | 2500VDC | SMD | 开板贴片式CAN | ||||
| TD5(3)21SCANH | √ | 1 | 40k~1M | 3.3-5 | 110 | 3000VDC | SMD | 开板贴片式高速CAN | - | - | - | - |
| TD321SCANH | √ | 1 | 40k~1M | 3.3 | 110 | 3000VDC | SMD | 开板贴片式高速CAN | ||||
| TD521SCANH | √ | 1 | 40k~1M | 5 | 110 | 3000VDC | SMD | 开板贴片式高速CAN | ||||
| TD5(3)22DCAN | √ | 2 | 40k~1M | 3.3-5 | 110 | 2500VDC | DIP | 双通道相互隔离 | - | - | - | - |
| TD322DCAN | √ | 2 | 40K~1M | 3.3 | 110 | 2500VDC | DIP | 双通道相互隔离 | ||||
| TD522DCAN | √ | 2 | 40K~1M | 5 | 110 | 2500VDC | DIP | 双通道相互隔离 | ||||
| TD5(3)31SCANFD | √ | 1 | 40k~5M | 3.3-5 | 110 | 2500VDC | SMD | 小体积SMD封装CANFD | - | - | - | - |
| TD331SCANFD | √ | 1 | 40k~5M | 3.3 | 110 | 2500VDC | SMD | 小体积SMD封装CANFD | ||||
| TD531SCANFD | √ | 1 | 40k~5M | 5 | 110 | 2500VDC | SMD | 小体积SMD封装CANFD | ||||
| TD5(3)31SCANH | √ | 1 | 40k~1M | 3.3-5 | 110 | 2500VDC | SMD | 小体积SMD封装CAN | - | - | - | - |
| TD331SCANH | √ | 1 | 40k~1M | 3.3 | 110 | 2500VDC | SMD | 小体积SMD封装CAN | ||||
| TD531SCANH | √ | 1 | 40k~1M | 5 | 110 | 2500VDC | SMD | 小体积SMD封装CAN | ||||
| TD541SCANFD | √ | 1 | 5M | 3.3-5 | 110 | 5000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | - | - | - |
| TD541SCANFD | √ | 1 | 5M | 3.3,5 | 110 | 5000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | |||
| TD541SCANH | √ | 1 | 1M | 3.3-5 | 110 | 5000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | - | - | - |
| TD541SCANH | √ | 1 | 1M | 3.3,5 | 110 | 5000VDC | DFN | 超小，超薄，芯片级 DFN 封装 | - | |||
| TD551SCANH3 | √ | 1 | 5M | 4.5-5.5 | 110 | 5000VAC | SOIC | - | - | - | - | - |
| TD551SCANH3 | √ | 1 | 5M | 4.5-5.5 | 110 | 5000VAC | SOIC | - | - | |||
| TD551SCANHW3 | - | 1 | 5M | 4.5-5.5 | 110 | 5000VAC | SOIC | - | - | - | - | - |
| TD551SCANHW3 | - | 1 | 5M | 4.5-5.5 | 110 | 5000VAC | SOIC | - | - | |||
| TDH301DCAN-RGX | √ | 1 | 1M | 3.3 | 110 | 5000VAC | - | - | - | - | - | - |
| TDH301DCAN-RGX | √ | 1 | 1M | 3.3 | 110 | 5000VAC | - | - | - | |||
| TDHx01DCAN | √ | 1 | 1M | 3.3-5 | 110 | 5000VDC | DIP | 单路高隔离 | - | - | - | - |
| TDH301DCAN | √ | 1 | 5K-1M | 3.3 | 110 | 5000VDC | DIP | 单路高隔离 | ||||
| TDH501DCAN | √ | 1 | 5K-1M | 5 | 110 | 5000VDC | DIP | 单路高隔离 | ||||
| TDx01DCANH3(G) | √ | 1 | 1M | 3.3-5 | 110 | 3000VDC | DIP | 增强版CAN | - | - | - | - |
| TD301DCANH3G | √ | 1 | 1M | 3.3 | 110 | 3000VDC | DIP | - |
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| TD301DCANH3 | √ | 1 | 1M | 3.3 | 110 | 3000VDC | DIP | 增强版CAN | - | |||
| TD501DCANH3 | √ | 1 | 1M | 5 | 110 | 3000VDC | DIP | 增强版CAN | - | |||
| TDx01MCAN(HG) | √ | 1 | 1M | 3.3-5 | 110 | 2500VDC | DIP | 超小体积CAN | - | - | - | - |
| TD301MCAN | √ | 1 | 1M | 3.3 | 110 | 2500VDC | DIP | 超小体积CAN | ||||
| TD301MCANHG | √ | 1 | 1M | 3.3 | 110 | 2500VDC | DIP | - |
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| TD501MCAN | √ | 1 | 1M | 5 | 110 | 2500VDC | DIP | 超小体积CAN | ||||
| TD501MCANHG | √ | 1 | 1M | 5 | 110 | 2500VDC | DIP | - |
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| TDx01DCAN | √ | 1 | 5k~1M | 3.3-5 | 110 | 3000VDC | DIP | ESD总线保护 | - | - | - | - |
| TD301DCAN | √ | 1 | 5K~1M | 3.3 | 110 | 3000VDC | DIP | ESD总线保护 | ||||
| TD501DCAN | √ | 1 | 5K~1M | 5 | 110 | 3000VDC | DIP | ESD总线保护 | - | |||
| TDx02DCAN | √ | 2 | 1M | 3-5.5 | 110 | 2500VDC | DIP | 高隔离 | - | - | - | - |
| TD302DCAN | √ | 2 | 1M | 3.3 | 110 | 2500VDC | DIP | 高隔离 | - | |||
| TD502DCAN | √ | 2 | 1M | 5 | 110 | 2500VDC | DIP | 高隔离 | - |
* 上方产品参数仅供参考，详细技术参数请以技术规格书为准
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系列标题
